JPS6253035B2 - - Google Patents
Info
- Publication number
- JPS6253035B2 JPS6253035B2 JP20221181A JP20221181A JPS6253035B2 JP S6253035 B2 JPS6253035 B2 JP S6253035B2 JP 20221181 A JP20221181 A JP 20221181A JP 20221181 A JP20221181 A JP 20221181A JP S6253035 B2 JPS6253035 B2 JP S6253035B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- alloy powder
- conductive
- paint
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 48
- 239000003973 paint Substances 0.000 claims description 29
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 230000005012 migration Effects 0.000 description 15
- 238000013508 migration Methods 0.000 description 15
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 239000012964 benzotriazole Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910020888 Sn-Cu Inorganic materials 0.000 description 5
- 229910019204 Sn—Cu Inorganic materials 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20221181A JPS58103567A (ja) | 1981-12-14 | 1981-12-14 | 導電性ペイント |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20221181A JPS58103567A (ja) | 1981-12-14 | 1981-12-14 | 導電性ペイント |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58103567A JPS58103567A (ja) | 1983-06-20 |
| JPS6253035B2 true JPS6253035B2 (en]) | 1987-11-09 |
Family
ID=16453795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20221181A Granted JPS58103567A (ja) | 1981-12-14 | 1981-12-14 | 導電性ペイント |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58103567A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60184456U (ja) * | 1984-05-18 | 1985-12-06 | 三菱電機株式会社 | 歯車 |
| JP2708606B2 (ja) * | 1990-05-22 | 1998-02-04 | 旭化成工業株式会社 | 銅合金導電性ペースト並びに該ペーストを用いた導電体 |
| JP4928021B2 (ja) * | 2001-03-13 | 2012-05-09 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
-
1981
- 1981-12-14 JP JP20221181A patent/JPS58103567A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58103567A (ja) | 1983-06-20 |
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